A Acid based process for post-treatment of Tin or Tin-Lead plated components. Prevent discolouration during heat treatment > 200 °C and therefore improves the solderability.
This is a Weakly Alkaline product for the post treatment of Tin and Tin-Lead plated components. It is made up using a liquid concentrate. It is effective at removing processing residues from the surfaces of plated components, thereby enhancing long term solderability performance.