An acidic electrolyte for the deposition of light grey, Matt Bismuth layers with a good solderability. The melting point of Pure Bismuth is 271 °C and allows higher solder temperatures than Tin.
An acidic electrolyte for the deposition of White, Matt Indium layers with a good solderability. The melting point of Pure Indium is 156 °C. The application field of the surface is e.g. the coating of plug-in connectors and press-fit pins. The electrolyte can be used for rack applications as well as for continuous plating lines.
Strongly acidic electrolyte for the deposition of Semi-Matt, finely crystalline Tin-Silver alloys with approx. 3% by weight Ag for Reel to Reel, Rack and Barrel systems.
An electrolyte on Sulphuric Acid basis for the deposition of Bright Tin-Copper layers with a co-deposition of about 1 – 10 % Cu. The tendency to form whiskers is reduced.
Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright Tin-Lead coatings. Haze-free bright coatings are easily achieved with 5 – 35 % Lead in the alloy.
Fluoride- and formalin-free electrolyte for the deposition of bright Tin-Lead coatings, primarily for alloys containing 5 – 40 % Lead. Mainly used in reel-to-reel installations.
An acidic fluoride-free electrolyte which produces matt fine grained Tin-Lead deposits. Formulated specifically for high speed (such as reel to reel plating of connector pins, IC lead frames or wire plating).
Tin-Nickel alloy electrolyte for the deposition of black, even and well-adhering layers over a wide applicable current density range. It is preferably used on Tin-Nickel alloy surfaces.
Weakly acidic, fluoride-containing electrolyte for the deposition of shine-preserving layers with an alloy composition of 65% by weight Sn and 35% by weight Ni.