Fluoride-free, Acidic electrolyte for the deposition of Bright Tin coatings in reel-to-reel installations. Depending on plant design and operating temperature high current densities can be achieved. Foaming of the additives is very low, even during intensive electrolyte agitation.
Organic-based fluoride and formaldehyde-free process for the deposition of Bright Tin coatings. Solderability of the Tin coatings is excellent, even after accelerated heat ageing. The deposits are not sensitive towards fingerprints. Special developed Tin additive, as far as possible avoids sticking together of small electronic components (ceramic chips).
Suitable for both Rack and Barrel applications, this process can be operated using Sulphuric Acid or a mixture of MSA and sulphuric acid. Together with excellent tarnish resistance the deposit is solderable after heat ageing tests and, by using low foaming additives, solution foaming is not an issue.
Alkaline, cyanide containing electrolyte for the use in continuous and reel-to-reel plating lines. The hardness of the freshly deposited Silver layers is between 160 and 180 HV0.05 and decreases only insignificantly during storage.
Ideally suited for the manufacture of PCBs, electronic and precision components, this Sulphuric Acid based process gives a fine grain deposit with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.
The Silver bath is an electrolyte for strip and continuous systems which deposits shiny, haze-free Silver coatings on Copper, Brass, Nickel Silver and on intermediate layers of Nickel.
Sulphate-free electrolyte giving a fine crystalline deposit with excellent covering power. Compatible with lead-free solders. Tendency to whisker formation is reduced.
A strongly acidic, fluoride-free process for the deposition of Matt to Silky-Matt, fine crystalline coatings. This process is applied in barrel plants. Components plated with Tin SLOTOTIN 1110 show clearly less tendency to stick together.
The Tin bath is a sulphate-free electrolyte for the deposition of Semi-bright, light Tin layers even at low current densities, eg on geometrically unfavorable parts. It only contains low-foaming additives, so that no disruptive foaming occurs during drum coating.