Product Information
Copper
Bright Copper ACG 8
This Acid Copper electrolyte produces a very bright deposit with excellent levelling. The process is controlled with a single additive making it very easy to control. The plated deposit has a high deposition rate, very low internal stress and is soft which makes polishing very easy.
Bright Copper SLOTOCOUP TB 50
A decorative Acid Copper process giving a mirror bright, highly levelled deposit. Levelling performance is maintained even at low current densities. This Sulphuric Acid based electrolyte has a stable additive system and wide operating parameters. Operating temperature of the bath is 20 – 30°C (25°C) optimum and the current density varies between 1 and 6A/dm². Deposition rate is 0.88 µm/minute at 4A/dm².
Copper SLOTOCOUP BV 50
For production of HDI-PCBs in order to fill blind microvias with Copper, pattern plating, metallize through holes in a one step process.
Copper SLOTOCOUP SF 50
The Copper bath is used both in the production of Printed Circuit Boards for conductive pattern construction (L/S < 50/50) and for plating blind micro vias (BMV) with very good filling capacity.
Copper SLOTOCOUP TF 1350
The Copper bath was specially developed for filling through holes.
Copper SLOTOCOUP XF 60
Filling of blind microvias with a very thin surface layer thickness.
Copper SLOTOCOUP HL 10
Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating).
Copper SLOTOCOUP BC 2610
Copper electrolyte, strongly acidic, for depositing high-gloss Copper layers in horizontal continuous plating lines and reel-to-reel systems.
Bright Copper CUPRUM 10
Cyanide based high-performance electrolyte for the deposition of bright, smooth, fine crystalline and ductile Copper layers.
Copper SLOTOCOUP BV 110
Use in vertical continuous flow systems. Filling of blind microvias, conductive pattern construction and metallization of through-holes in one process step.
Copper SLOTOCOUP BCH 2440
Copper electrolyte, alkaline containing cyanide, for the deposition of smooth, finely crystalline and ductile layers. Specifically developed for horizontal continuous plating lines and reel-to-reel systems.
Copper SLOTOCOUP PRT 120
This electrolyte uses the advantages of Reverse Pulse Plating (RPP) in connection with continuous vertical plating plants optimally.